Wireless Temperature Sensor Having No Electrical Connections

Glenn's breakthrough technology introduces batch-fabricated, miniature sensors embedded and distributed over a large surface area of a material or product during the manufacturing process. The sensors can be utilized for test instrumentation or as an integrated in-situ monitoring system. This integrated manufacturing approach preserves the structural and mechanical system integrity by eliminating the antiquated plug-in approach, invasive machining, manual insertion, and gluing processes currently required to implant sensors into a material. The sensor ladder network of resistors and capacitors breaks down as result of the thermo-physical effects caused by temperature, shock, radiation, corrosion, or other reactions, causing a change in the electrical properties. A processor interprets these changes in the electrical properties and generates a high-resolution, large-area surface profile. The profile demonstrates the amount or rate of material deterioration and temperature change, and is used to optimize geometric structural design, develop materials, predict performance, and make decisions. These sensors play an important role as industries work to realize material performance and product design. This type of monitoring is ideal for infrastructures, nuclear enclosures, or any system susceptible to surface deterioration.

The thin film sensor’s principal advantage lies in its potential to take high frequency temperature measurements from the surface of a reentering spacecraft while simultaneously withstanding the high temperature and oxidizing environment encountered. This data provides engineers with operational phase measurements used to refine the spacecraft’s operational envelope and track flight hardware behavior in addition to providing high frequency temperature measurements that can inform the physics of a boundary layer. Mismatches in coefficients of thermal expansion (CTE) are expected in TPS-based sensor applications because the metallic materials used for temperature sensing have thermal expansion rates that differ from the rates of the substrate and coating materials in the TPS. At high temperatures during reentry, this mismatch in CTE can create a significant strain differential between the metallic sensor, sensor leads, and the materials to which the sensor and leads are bonded. High frequency response temperature measurements on the surface of entry spacecraft are not currently possible above ~700 F with existing measurement capabilities. This shortcoming is primarily due to the need for robust sensor behavior at temperatures of several thousand degrees F. The sensor design of this technology preserves the integrity of sensor components while enhancing its high temperature functionality. The thin film temperature sensor has a technology readiness level (TRL) 5 (Component and/or breadboard validation in relevant environment) and is now available for patent licensing. Please note that NASA does not manufacture products itself for commercial sale.

The technology presents a fundamental change in the way electrical devices are designed, using an open circuit in conjunction with a floating electrode, or an electrically conductive object not connected to anything by wires, and powered through a wireless device. This system uses inductor-capacitor thin-film open circuit technology. It consists of a uniquely designed, electrically conductive geometric pattern that stores energy in both electric and magnetic fields, along with a floating electrode in proximity to the open circuit. When wirelessly pulsed from the handheld data acquisition system (U.S. Patent Number 7,159,774, Magnetic Field Response Measurement Acquisition System), the system becomes electrically active and develops a capacitance between the two circuit surfaces. The result is a device that acts as a parallel plate capacitor without electrical connections.

Conventional ambient-temperature oxygen sensors are limited in various ways: optically based sensors can be expensive and challenging to manufacture; electrochemical cells with liquid electrolytes can have limited lifetimes and become leak sources; and both types of sensors are difficult to miniaturize. These problems are addressed with Glenn's novel ambient temperature oxygen microsensor, which is based on a Nafiontm polymer electrolyte, microfabricated using thin-film technologies. In the past, one drawback of Nafiontm film has been that it can lose conductivity when the moisture content in the film is too low, potentially affecting sensor operation. Glenn researchers devised a method to use certain salts to hold water molecules in the Nafiontm film structure at room temperature. The presence of these salts provides extra sites in the film to promote proton (H+) mobility, thus improving film conductivity and overall sensor performance, particularly in arid and high-temperature environments. The innovative use of metal/metal oxide as the reference electrode enables miniaturization by eliminating the reference gas and sealing the reference electrode. The combination of interdigitized electrodes with the unique metal/metal oxide reference electrode permits sensor operation in either potentiometric or amperometric mode, as appropriate. In potentiometric mode, which measures voltage differences between working and reference electrodes in different gases, the voltage differences can be monitored with a voltmeter; however, the sensor itself does not need a power source. In room-temperature testing, the sensor achieved repeatable responses to 21 percent oxygen in nitrogen (using nitrogen as a baseline gas), and also detected oxygen from 7 to 21 percent, making Glenn's breakthrough technology usable for personal health monitoring as well as fire detection, fuel-leak detection, and environmental monitoring.

Prior approaches to bonding a SiC sensor and a SiC cover member relied on either electrostatic bonding or direct bonding using glass frits. The problem with the former is that its relatively weak bond strength may lead to debonding during thermal cycling, while the latter requires the creation of apertures that can allow sealant to leak. Glenn's innovation uses NASA's microelectromechanical system direct chip attach (MEMS-DCA) technology that can be bulk-manufactured to reduce sensor costs. The MEMS-DCA process allows a direct connection to be made between chip and pins, thereby eliminating wire bonding. Sensors and electronics are attached in a single-stage process to a multifunctional package, which, unlike previous systems, can be directly inserted into the housing. Additional thick pins within the electrical outlet allow the package to be connected to external circuitry. Furthermore, because the top and bottom substrates' thermomechanical properties are similar to that of the sensors, the problem of mismatch in the coefficient of thermal expansion is significantly reduced, minimizing thermal cycling and component fatigue. By protecting sensors and electronics in temperatures up to 600°C, approximately twice what has previously been achievable, Glenn's innovation enables SiC components to realize one of their most exciting possibilities - direct placement within high-temperature environments.