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This technology (AERoBOND) enables the assembly of large-scale, complex composite structures while maintaining predictable mechanical and material properties. It does so by using a novel barrier-ply technology consisting of an epoxy resin/prepreg material with optimal efficiency, reliability, and performance. The barrier-ply materials prevent excessive mixing between conventional composite precursors and stoichiometrically-offset epoxy precursors during the cure process by forming a gel early in the cure cycle before extensive mixing can occur. The barrier ply is placed between the conventional laminate preform and the stoichiometrically-offset ply or plies placed on the preform surface, thus preventing excessive mass transfer between the three layers during the cure process. In practice, the barrier ply could be combined with the offset ply to be applied as a single, multifunctional surfacing layer enabling unitized assembly of large and complex structures. The AERoBOND method is up to 40% faster than state-of-the-art composite manufacturing methods, allows for large-scale processing of complex structures, eliminates the potential for weak bond failure modes, and produces composites with comparable mechanical properties as compared with those prepared by co-cure.

The AERoBOND and AERoBOND+ technologies are composite resin materials design innovations that enable new methods for composites joining and manufacturing. The resins are formulated with carefully selected off-set stoichiometries to delay/control the cure such that initial curing of individual components can be followed separately by joining/curing of components together. The ability to delay and control the co-cure joining step provides ease of manufacturing of multi-part composite structures, without compromising joint integrity. There are significant cost savings associated with eliminating fasteners and joint surface preparation steps. To date, the focus of the NASA development effort has been on novel epoxy-based prepreg formulations though other types of thermosets could be considered as well. The AERoBOND+ innovation provides an added adhesive layer to the AERoBOND joint design to improve the ability to join composite surfaces when these surfaces are less tightly matched. Conventional adhesives, e.g., film, paste, etc., are employed. By including an adhesive between the offset stoichiometric prepreg plies, the adhesive can fill the gaps between the bonding surfaces while maintaining reflowable AERoBOND layer interfaces. Since all interfaces are reflowable, they are much more tolerant of surface contamination, thereby mitigating a primary challenge for conventional adhesive bonding.

NASA's technology is the first successful 3D-printing of high temperature carbon fiber filled thermoset polyimide composites. Selective Laser Sintering (SLS) of carbon-filled RTM370 is followed by post-curing to achieve higher temperature capability, resulting in a composite part with a glass transition temperature of 370 °C. SLS typically uses thermoplastic polymeric powders and the resultant parts have a useful temperature range of 150-185 °C, while often being weaker compared to traditionally processed materials. Recently, higher temperature thermoplastics have been manufactured into 3D parts by high temperature SLS that requires a melting temperature of 380 °C, but the usable temperature range for these parts is still under 200 °C. NASA's thermoset polyimide composites are melt-processable between 150-240 °C, allowing the use of regular SLS machines. The resultant parts are subsequently post-cured using multi-step cycles that slowly heat the material to slightly below its glass transition temperature, while avoiding dimensional change during the process. This invention will greatly benefit aerospace companies in the production of parts with complex geometry for engine components requiring over 300 °C applications, while having a wealth of other potential applications including, but not limited to, printing legacy parts for military aircraft and producing components for high performance electric cars.

NASA's System for In-situ Defect (e.g., porosity, fiber waviness) Detection in Composites During Cure consists of an ultrasonic portable automated C-Scan system with an attached ultrasonic contact probe. This scanner is placed inside of an insulated vessel that protects the temperature-sensitive components of the scanner. A liquid nitrogen cooling systems keeps the interior of the vessel below 38°C. A motorized X-Y raster scanner is mounted inside an unsealed cooling container made of porous insulation boards with a cantilever scanning arm protruding out of the cooling container through a slot. The cooling container that houses the X-Y raster scanner is periodically cooled using a liquid nitrogen (LN2) delivery system. Flexible bellows in the slot opening of the box minimize heat transfer between the box and the external autoclave environment. The box and scanning arm are located on a precision cast tool plate. A thin layer of ultrasonic couplant is placed between the transducer and the tool plate. The composite parts are vacuum bagged on the other side of the tool plate and inspected. The scanning system inside of the vessel is connected to the controller outside of the autoclave. The system can provide A-scan, B-scan, and C-scan images of the composite panel at multiple times during the cure process. The in-situ system provides higher resolution data to find, characterize, and track defects during cure better than other cure monitoring techniques. In addition, this system also shows the through-thickness location of any composite manufacturing defects during cure with real-time localization and tracking. This has been demonstrated for both intentionally introduced porosity (i.e., trapped during layup) as well processing induced porosity (e.g., resulting from uneven pressure distribution on a part). The technology can be used as a non-destructive evaluation system when making composite parts in in an oven or an autoclave, including thermosets, thermoplastics, composite laminates, high-temperature resins, and ceramics.