Silicon Carbide (SiC) Fiber-Reinforced SiC Matrix Composites

SiC fiber tows and preform materials are commonly used as reinforcements in CMCs, to make parts for use in harsh, high-temperature environments such as aircraft engines. These materials are desirable for numerous high-temperature applications because of their very low weight and outstanding thermo-chemical inertness. However, the multiple-step process using electric furnaces to produce these materials have numerous drawbacks: they are very expensive ($10,000 to $25,000 per spool); they involve high temperatures (greater than 2000°C); they require high power (more than 700 watts); and they produce much wasted material. Glenn innovators have discovered an efficient way to improve the quality and strength of SiC fiber tows using a unique microwave-furnace design that induces molecular heating. Glenn's innovation relies on microwave sintering to convert a polymer to ceramic fibers/tows/yarns, or to manipulate commercially available SiC fibers to increase strength and improve other qualities. Not only can higher quality tows be produced, but also - for the first time - old, damaged, or otherwise unusable fibers can be improved and recycled, thereby saving significant costs by increasing yield. Even entire engine components can be placed in the furnace and restored. The desired results can be achieved in minutes rather than the usual hours or even days. Glenn's low-temperature microwave process provides greater control with less power, while also eliminating plasma generation and minimizing arcing events. Because this method also facilitates the shaping of the SiC fiber after initial processing, fabricating preforms with 2D or 3D architectures becomes simpler. Glenn's creative processing method makes producing SiC tows and preforms much less expensive, opening them up for increased use in a broad range of applications.

CMCs are a game-changer for a number of applications because of their lighter weight, higher temperature capability, and resistance to oxidation. It has been estimated that aircraft designs relying on CMCs can decrease fuel consumption by 10% by 2020. EBCs are used to protect CMCs from water vapor and other corrosive gases inside engines and other extreme environments. The current state of the art for EBCS features a silicon bond coat that is not viable beyond its melting point of 1482°C. By contrast, Glenn's EBCs have demonstrated a steam oxidation life of at least 500 hours at 1482°C, making them ideal durable coatings for next-generation CMCs. These EBCs are slurries, with either a mullite-based bond coat or a rare earth disilicate-based bond coat comprising at least three and two layers, respectively. Mullite is often used as a refractory material for furnaces, reactors, etc. because of its high melting point (1840°C). Rare earth disilicates also have high melting points (~1800°C). These bond coats can be fabricated by preparing a mixture of a coating material, a primary sintering aid, at least one secondary sintering aid, and a solvent. The mixture is then processed (e.g., in a milling media) to form a slurry that can be deposited to a CMC substrate. The sintering aids have two primary functions: 1) densifying deposited slurry by generating liquid phases via reactions with the coating material and other sintering aids, so that the liquid fills gaps between particles of coated material; 2) enhancing bonding and performance of the coating by generating reaction products that enhance those qualities. One great advantage of this EBC is that it can be fabricated via various low-cost methods - including dipping, spinning, spin-dipping, painting, and spraying - in addition to plasma-spraying. Glenn's innovation rises to meet the need for a new class of EBCs that can keep up with CMCs' increasing ability to withstand higher temperatures and stresses than ever before.

Prior approaches to bonding a SiC sensor and a SiC cover member relied on either electrostatic bonding or direct bonding using glass frits. The problem with the former is that its relatively weak bond strength may lead to debonding during thermal cycling, while the latter requires the creation of apertures that can allow sealant to leak. Glenn's innovation uses NASA's microelectromechanical system direct chip attach (MEMS-DCA) technology that can be bulk-manufactured to reduce sensor costs. The MEMS-DCA process allows a direct connection to be made between chip and pins, thereby eliminating wire bonding. Sensors and electronics are attached in a single-stage process to a multifunctional package, which, unlike previous systems, can be directly inserted into the housing. Additional thick pins within the electrical outlet allow the package to be connected to external circuitry. Furthermore, because the top and bottom substrates' thermomechanical properties are similar to that of the sensors, the problem of mismatch in the coefficient of thermal expansion is significantly reduced, minimizing thermal cycling and component fatigue. By protecting sensors and electronics in temperatures up to 600°C, approximately twice what has previously been achievable, Glenn's innovation enables SiC components to realize one of their most exciting possibilities - direct placement within high-temperature environments.

NASA Glenn's durable, extreme-temperature, integrated circuit chips begin with the replacement of conventional silicon IC transistors with n-channel SiC junction field effect transistors (JFET) and resistors that can reliably function above 500°C. JFETs with the necessary high-temperature stability and electrical gain are fabricated from commercial 4H-SiC wafers with epilayers using dry etching and a self-aligned n-type ion implantation. An innovative circuit approach creates digital logic gates from these normally-on n-channel JFETs and resistors. Using two levels of 500°C durable metal to interconnect numerous SiC gates, complex circuits enabling a variety of control, operation and sensing functions for intelligent systems in harsh environments can be implemented in physically small chips. The challenge of getting electrical signals to and from the chip in a harsh environment is overcome by the use of the iridium interfacial stack (IrIS) that acts simultaneously as a bond metal and diffusion barrier, and can be used on an ohmic contact to the SiC. Combined with Glenn-developed high-temperature durable ceramic chip packaging and harsh environment sensor technology, this revolutionary durable integrated circuit technology is game changing for harsh-environment applications of all types.

To avoid catastrophic failure, traditional electrical ohmic contacts must be placed at some distance from the optimal position (especially for sensors) in high-temperature environments. In addition, conventional metallization techniques incur significant production costs because they require multiple process steps of successive depositions, photolithography, and etchings to deposit the desired ohmic contact material. Glenn's novel production method both produces ohmic contacts that can withstand higher temperatures than ever before (up to 600°C), and permits universal and simultaneous ohmic contacts on n- and p-type surfaces. This makes fabrication much less time-consuming and expensive while also increasing yield. This innovative approach uses a single alloy conductor to form simultaneous ohmic contacts to n- and p-type 4H-SiC semiconductor. The single alloy conductor also forms an effective diffusion barrier against gold and oxygen at temperatures as high as 800°C. Glenn's extraordinary method enables a faster and less costly means of producing SiC-based sensors and other devices that provide quicker response times and more accurate readings for numerous applications, from jet engines to down-hole drilling, and from automotive engines to space exploration.